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as that of Sn-Pb solder. Other values reported were Sn-57Bi at 0.323 volts, Sn-9Zn at 0.624 volts, Sn-3.5Ag at 0.937 volts, and Sn-80Au at 1.636 volts. So tin-lead solder is significantly more resistant to corrosion and dendritic growth than the other seven alloys studied. This will be an area to watch as the world moves forward with Pb-free soldering.

The European Union s RoHS legislation has spawned widespread changes in electronic assembly The biggest among them is the required move to Pb-free solders for most electronic products Although this topic is a hotly debated, the use of elemental lead (Pb) in the electronics industry and more specifically in solders is a small percentage of the total industrial use of Pb worldwide Accurate and current numbers are difficult to come by, but estimates range from less than 1 percent to as much as 10 percent worldwide There are some excellent reasons, though, to find suitable substitutes for Pb where possible Pb is toxic and governments worldwide spend large sums on abatement programs, education, and health care assistance to those afflicted with toxic levels of lead, mostly from peeling Pb-based paint, which is already regulated Pb salts are sweet to the taste but toxic.

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The Romans purportedly added Pb salts to sweeten their wine Electronic assemblies are rarely linked to toxicity through oral ingestion, but may be the source of contamination through improper disposal of the assemblies, components, raw materials, or their by-products Purity of the water table may be affected by inappropriate land-filling of large quantity of Pb-bearing circuit boards; solder dross; spent solder pot contents; trace concentrations released as part of aqueous cleaning processes; and Pb-bearing ion exchange filters from aqueous cleaning units, plating baths, etc Replacement solders, while perhaps nontoxic themselves, may require deleterious raw stock or result in noxious by-products from processing or from ore refinement It is wise to proceed cautiously and look at the impact of Pb removal from the electronics industry from all perspectives.

There are many nonPb bearing materials associated with printed circuit board assembly, each with a set of material components and process chemicals that may be problematic in a public health sense Products, by-products, raw materials, and their derivatives must be handled and disposed of in a conscientious and environmentally considerate manner Attention to better reclamation and disposal methods of industrial and household waste streams, as well as adequate education concerning the same, probably holds more significance to public health than defining a quick substitution for Sn-Pb solder However, it is the requirement and, therefore, a knowledge of alternatives is mandatory for design and process engineers The database for the material properties of widely used Sn-Pb solders is still incomplete Needless to say, for a new Pb-free solder system, it will be much less complete and take several years to characterize the qualities and performance of a new solder.

aerostatic 100% hydrostatic 100% rolling element 100% 100% 100% 100% 100% 100% 100%

Since so many new solders are being investigated, this will further slow down solder development and characterization since efforts will be spread out rather than concentrated on a common solder alloy As of this writing, several corporations have had product recalls associated with the changeover to Pb-free solders where there were unknown interactions with soldering system materials or lower-than-expected field reliability..

197 811 Fully populated DT104 board 197.

manufactured from different formulations or compositions of materials and will have a designed-in thermal EMF error due to component selection.

Digital Electrical Signal Integrity Each digital logic family of integrated circuits has manufacturer-specified electrical operating parameters and signal transfer characteristics, many of which have become industry standards due to multiple sourcing (manufacturing) of the family of components. The electrical signal integrity requirements for digital ICs are primarily the high and low electrical (voltage/current) requirements for the output, input, clock, set, reset, clear, and other signal names; the signal rise/fall times, clock frequency(s) and setup/hold times; and the voltage and ground connections as are necessary for the control and operation of the IC. The input, output, and electrical signal transfer parameters and characteristics for digital ICs vary from logic or microprocessor family to family. Signal ICs are a large matrix of components, consisting of the semiconductor substrate materials, such as silicon, silicon/germanium, and gallium arsenide, that make up the various types of transistors. As shown in Table 15.2, the large number of digital IC families available create a complex matrix of design issues and requirements.

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