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TABLE 15.2 Typical Digital Logic Rise and Fall Times Logic family STD TTL L S ALS FTTL BiCMOS Typical rise/fall time, ns 5 6.5 3.5 1.9 1.2 0.7 Logic family H HCT AC ACT 10K ECL 100ECL GaAs Typical rise/fall time, ns 6 8 3 0.7 0.5 0.3

The electrical signal integrity of the rise and fall times of electrical signals is a major driver and concern for high-speed and high-frequency printed circuits. Table 15.2 lists some of the typical rise and fall times of some of the popular digital logic families.

aerostatic 100% hydrostatic 100% rolling element 100% 100% 100% 100% 100% 100% 100%

Electromagnetic compatibility (EMC) is a serious design requirement for both functional performance to design and regulatory compliance requirements. EMC encompasses the control and reduction of electromagnetic fields (EMF), electromagnetic interference (EMI), and radio frequency interference (RFI) and covers the whole electromagnetic frequency spectrum from dc to 20 GHz. Worldwide, the electronics industry has had to pay increasing attention to EMC to comply with both national and international standards and regulations. EMC involves major design considerations that ensure proper function within the electronic component, assembly, or system in order to: 1. Limit the emission (radiative or conductive) from one electronic component assembly, or system, to another. 2. Reduce the susceptibility of an electronic component, assembly, or system to external sources of EMF, EMI, or RFI.

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There are three keys to EMC: 1. Design the product so that it produces less stray electromagnetic energy. 2. Design the product so that it is less susceptible to stray electromagnetic energy. 3. Design the product to prevent stray electromagnetic energy from entering or leaving the product.

9.1 9.2 9.3 9.4 9.5 10.1 10.2 10.3 10.4 10.5 10.6 10.7

Good design requires up-front determination of a noise budget, which should be included in the product definition requirements. The noise budget is the summation of all of the dc and ac voltages (or currents) that form a boundary within which the component, assembly, or system is designed to function. e noise = edc + eac where edc = dc electrical noise eac = ac electrical noise (15.1)

The dc noise budget consists of the voltage settings (preset) of the power supplies, the operating tolerance of the power supply, and the series dc voltage drops of the voltage distribution system. The ac noise budget consists of the effectiveness of the local bypass capacitor, the amount of decoupling between the load, the bulk decoupling capacitor, and the power distributions system, the local voltage drops in the component s voltage/ground conductors, and the component s input voltage tolerance. As mentioned in Sec. 15.5.3, many of the operating electrical, mechanical, thermal, and environmental parameters and conditions can have a major influence on the noise budget. With a limited focus on digital designs, additional noises that may need to be considered are EMC radiated and conducted emissions from other electromagnetic equipment and thermally generated voltages (thermocouple effect) due to electrical connections with differing layers of metals operating at different temperatures. The following is a list of most of the electrical voltages that should be considered for a noise margin analysis: Switching noise* Cross-talk* Impedance mismatch* Component wirebond (IR) Changes in supply voltage Changes in junction temperature Changes in die ground voltage (IR) Component lead (IR)

Fig 772: Bearing systems for precision machines [37]

Of the 90 naturally occurring elements, only 13 can be practically combined with each other to form a practical solder (see Fig. 45.1).

FIGURE 45.1 Highlighted elements can be combined to form solders useful for circuit board assembly.

Of those elements that can combine to form solders, several have limitations that restrict their practical implementation for solder use (see Table 45.2). Gallium, gold, indium, platinum, and palladium cannot be mined or refined in sufficient quantity to satisfy the needs of the electronics industry and are prohibitively expensive, blocking their consideration as a major constituent of a worldwide solder supply. The Bismuth (Bi) supply, a by-product of lead refining, would be marginally sufficient. Mercury and antimony are too toxic. Both mercury and Pb are already on the EU s RoHS list of restricted materials. Gallium and mercury possess too low a melting point to be used on their own. This leaves five metals for practical solder alloy consideration: bismuth (Bi), copper (Cu), silver (Ag), tin (Sn), and zinc (Zn). Due to

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